VIA LABS INC dividends
Last dividend for VIA LABS INC (6756.TW) as of May 2, 2024 is 2.00 TWD. The forward dividend yield for 6756.TW as of May 2, 2024 is 3.84%.
Dividend history for stock 6756.TW (VIA LABS INC) including historic stock price, payout ratio history and split, spin-off and special dividends.
VIA LABS INC Dividends
| Ex-dividend date | Payable date | Dividend amount (change) | Adjusted Price | Close Price |
|---|---|---|---|---|
| 2024-04-18 | 1.9980 TWD (-73.32%) | 195.00 TWD | 195.00 TWD | |
| 2023-04-14 | 7.4887 TWD (-31.84%) | 228.00 TWD | 228.00 TWD | |
| 2022-04-07 | 10.9864 TWD (144.14%) | 391.50 TWD | 379.02 TWD | |
| 2021-04-09 | 4.5000 TWD (36.36%) | 298.50 TWD | 281.30 TWD | |
| 2020-07-08 | 3.3000 TWD | 126.00 TWD | 117.06 TWD |
6756.TW
Price: NT$195
Dividend Yield: 0.01%
Forward Dividend Yield: 3.84%
Payout Ratio: 290.26%
Dividend Per Share: 2.00 TWD
Earnings Per Share: 2.58 TWD
P/E Ratio: 85.27
Exchange: TAI
Sector: Technology
Industry: Computer Hardware
Market Capitalization: 15.2 billion
Average Dividend Frequency: 1
Years Paying Dividends: 4