VIA LABS INC ( 6756.TW) Dividends
Last dividend for VIA LABS INC (6756.TW) as of April 23, 2025 is 1.80 TWD. The forward dividend yield for 6756.TW as of April 23, 2025 is 2.11%. Average dividend growth rate for stock VIA LABS INC (6756.TW) for past three years is -21.44%.
Dividend history for stock 6756.TW (VIA LABS INC) including historic stock price, dividend growth rate predictions based on history and split, spin-off and special dividends.
VIA LABS INC Dividends
| Ex-dividend date | Payable date | Dividend amount (change) | Adjusted Price | Close Price |
|---|---|---|---|---|
| 2025-04-18 | 2025-05-22 | 1.8000 TWD (-9.91%) | Upcoming dividend | |
| 2024-04-18 | 2024-05-22 | 1.9980 TWD (-73.32%) | 195.00 TWD | 195.00 TWD |
| 2023-04-14 | 2023-05-17 | 7.4887 TWD (-31.84%) | 228.00 TWD | 228.00 TWD |
| 2022-04-07 | 2022-05-06 | 10.9864 TWD (144.14%) | 391.50 TWD | 379.02 TWD |
| 2021-04-09 | 2021-05-12 | 4.5000 TWD (36.36%) | 298.50 TWD | 281.30 TWD |
| 2020-07-08 | 2020-07-29 | 3.3000 TWD | 126.00 TWD | 117.06 TWD |
6756.TW
Price: NT$84.50
Dividend Yield: 0.01%
Forward Dividend Yield: 2.11%
Payout Ratio: 74.00%
Dividend Per Share: 1.80 TWD
Earnings Per Share: 2.23 TWD
P/E Ratio: 48.88
Exchange: TAI
Sector: Technology
Industry: Computer Hardware
Market Capitalization: 7.6 billion
Average Dividend Frequency: 1
Years Paying Dividends: 6
DGR3: -21.44%