VIA LABS INC - Payout Ratio History
Payout ratio history for stock 6756.TW (VIA LABS INC).
| Date | Payout ratio |
|---|---|
| May 2024 | 77.44% |
| April 2024 | 290.26% |
6756.TW
Price: NT$195
Dividend Yield: 0.01%
Forward Dividend Yield: 1.03%
Payout Ratio: 77.44%
Dividend Per Share: 2.00 TWD
Earnings Per Share: 2.57 TWD
P/E Ratio: 75.68
Exchange: TAI
Sector: Technology
Industry: Computer Hardware
Market Capitalization: 13.5 billion
Average Dividend Frequency: 1
Years Paying Dividends: 5