POWERCHIP SEMICONDUCTOR MANUFAC dividends
Last dividend for POWERCHIP SEMICONDUCTOR MANUFAC (6770.TW) as of May 1, 2024 is 0.30 TWD. The forward dividend yield for 6770.TW as of May 1, 2024 is 2.63%.
Dividend history for stock 6770.TW (POWERCHIP SEMICONDUCTOR MANUFAC) including historic stock price, payout ratio history and split, spin-off and special dividends.
POWERCHIP SEMICONDUCTOR MANUFAC Dividends
| Ex-dividend date | Payable date | Dividend amount (change) | Adjusted Price | Close Price |
|---|---|---|---|---|
| 2023-03-13 | 0.3000 TWD (-58.85%) | 33.80 TWD | 33.80 TWD | |
| 2022-08-23 | 0.7290 TWD (-38.34%) | 33.95 TWD | 33.65 TWD | |
| 2022-02-24 | 1.1822 TWD (81.88%) | 53.30 TWD | 51.74 TWD | |
| 2021-08-25 | 0.6500 TWD (32.28%) | 65.10 TWD | 61.89 TWD | |
| 2021-04-08 | 0.4914 TWD | 75.10 TWD | 70.67 TWD |
6770.TW
Price: NT$22.85
Forward Dividend Yield: 2.63%
Payout Ratio: 127.66%
Dividend Per Share: 0.60 TWD
Earnings Per Share: -0.40 TWD
P/E Ratio: 57.02
Exchange: TAI
Sector: Technology
Industry: Semiconductors
Market Capitalization: 106.5 billion
Average Dividend Frequency: 2
Years Paying Dividends: 3